1Introduction 1
1.1Evolution of integrated circuit packaging 1
1.2Performance and design methodology for integrated circuit packaging 6
References 11
Further reading 12
2Electrical modeling and design 13
2.1Fundamental theory13
2.2Modeling， characterization， and design of through-silicon via packages 28
References 53
3Thermal modeling， analysis， and design 59
3.1Principles of thermal analysis and design 59
3.2Package-level thermal analysis and design 74
3.3Numerical modeling 89
3.4Package-level thermal enhancement 97
3.5Air cooling for electronic devices with vapor chamber configurations 101
3.6Liquid cooling for electronic devices 106
3.7Thermoelectric cooling 112
References 126
4Stress and reliability analysis for interconnects 131
4.1Fundamental of mechanical properties 131
4.2Reliability test and analysis methods 149
4.3Case study of design-for-reliability 227
References 239
5Reliability and failure analysis of encapsulated packages 245
5.1Typical integrated circuit packaging failure modes 245
5.2Heat transfer and moisture diffusion in plastics integrated circuit packages 245
5.3Thermal- and moisture-induced stress analysis 263
5.4Fracture mechanics analysis in integrated circuits package 270
5.5Reliability enhancement in PBGA package 282
References 290
Further reading 292
6Thermal and mechanical tests for packages and materials 293
6.1Package them叫tests 293
6.2Material mechanical test and characterization 306
References 322
7System-level modeling， analysis， and design 325
7.1System-level them叫modeling and design 325
7.2Mechanical modeling and design for microcooler system 348
7.3Codesign modeling and analysis for advanced packages 370
References 389
Appendix 1 Nomenclature 393
Appendix 2 Conversion factors 403
Index 405
內容試閱：
The technical level and development scale of the integrated circuit (IC) industry is one of the important indicators to measure a country’s industrial competitiveness and comprehensive national strength， and is the source of modern economic development. The application of IC has already become routine in various industries， such as military satellites， radar， civilian automotive electronics， smart equipment， and consumer electronics， etc. At present， the IC industry has formed three major industrial chains of design， manufacturing and packaging testing， which have become the indispensable pillar in the IC industry.
IC packaging is an indispensable process in the IC industry， which is the bridge from chip to device and device to system. It is a key fundamental manufacturing part of the IC industry and a competitive commanding height for the core device manufacturing of the IC industry.
With the rapid development of IC technology， higher and higher requirements for miniaturization， multi-function， high reliability and low cost of electronic products are put forward. Facing this situation， the electronic packaging materials and technologies are undergoing rapid development， promoting lots of advanced packaging materials. Advanced electronic packaging materials and technologies are the core of IC packaging.
In order to promote the development of China’s advanced electronic packaging industry and meet the urgent needs of researchers ranged from teaching and scientific study to engineering developing in the field of electronic packaging， the editorial committee has invited famous specialists to write the Series on Advanced Electronic Packaging Technology and Key Materials in recent years (English version). The series includes: “Advanced Polyimide Materials”， “From LED to Solid State Lighting”， “Freeform Optics for LED Packages and Applications”， “Modeling， Analysis， Design and Tests for Electronics Packaging beyond Moore”， “TSV(through-silicon via technology) Package” etc.
This series of books systematically describes the advanced electronic packaging from three aspects: advanced packaging materials， advanced packaging technologies and advanced packaging simulation design methods. This series covers the most advanced packaging materials such as polyimide materials and packaging technologies such as freeform optical technology， TSV(through-silicon via technology) packaging， and advanced packaging simulation design methods such as multi-physics analysis and applications. In addition， this series also makes a planning outlook and forecast for the development trend of advanced electronic packaging.
This series of books is of great worth for workers engaged in scientific research， production and application in electronic packaging and related industries， and also has great reference significance to teachers and students of related majors in higher education institutions.
We believe that the publication of this series of books will play a positive role in promoting the development of China’s IC industry and advanced electronic packaging industry.
Finally， we would like to express our sincere gratitude to our colleagues who have worked hard in the preparation of this series. We also express our heartfelt thanks to those who participated in organizing the publication of this series!
C.P.
IEEE Fellow
Member of Academy of Engineering of the USA
Member of Chinese Academy of Engineering
Former Bell Labs Fellow
Dean of Engineering， The Chinese University of Hong Kong
Regents’ Professor， Georgia Institute of Technology， Atlanta， GA 30332， USA
Sheng Liu， Ph.D.
IEEE Fellow， ASME Fellow
Chang Jiang Scholar Professor
Dean， School of Power and Mechanical Engineering，
Executive Director， Institute of Technological Sciences，
Wuhan University，
Wuhan， Hubei， China
Wenhui Zhu， Ph.D.
National Invited Professor
College of Mechanical and Electrical Engineering，
Central South University
Changsha， Hunan， China
購物車/收銀台(0) | 在線留言板
| 付款方式
| 聯絡我們
| 運費計算
| 幫助中心 |
加入書簽
HOME
新書上架
