TechnologyEngineeringMechanical
A bestselling MEMS text...now better than ever.
An engineering design approach to Microelectromechanical Systems,
MEMS and Microsystems remains the only available text to cover both
the electrical and the mechanical aspects of the technology. In the
five years since the publication of the first edition, there have
been significant changes in the science and technology of
miniaturization, including microsystems technology and
nanotechnology. In response to
內容簡介：
TechnologyEngineeringMechanical
A bestselling MEMS text...now better than ever.
An engineering design approach to Microelectromechanical Systems,
MEMS and Microsystems remains the only available text to cover both
the electrical and the mechanical aspects of the technology. In the
five years since the publication of the first edition, there have
been significant changes in the science and technology of
miniaturization, including microsystems technology and
nanotechnology. In response to the increasing needs of engineers to
acquire basic knowledge and experience in these areas, this popular
text has been carefully updated, including an entirely new section
on the introduction of nanoscale engineering.
Following a brief introduction to the history and evolution of
nanotechnology, the author covers the fundamentals in the
engineering design of nanostructures, including fabrication
techniques for producing nanoproducts, engineering design
principles in molecular dynamics, and fluid flows and heat
transmission in nanoscale substances.
Other highlights of the Second Edition include:
Expanded coverage of microfabrication plus assembly and packaging
technologies
The introduction of microgyroscopes, miniature microphones, and
heat pipes
Design methodologies for thermally actuated multilayered device
components
The use of popular SU–8 polymer material
Supported by numerous examples, case studies, and applied
problems to facilitate understanding and real–world application,
the Second Edition will be of significant value for both
professionals and senior–level mechanical or electrical engineering
students.
關於作者：
Tai–Ran Hsu, PhD, is a Professor in the Department of
Mechanical and Aerospace Engineering, San Jose State University,
California. Dr. Hsu is the author of the earlier edition of this
book, which is considered one of the bestselling textbooks on the
subject of MEMS.
目錄：
Preface
Chapter 1: Overview of MEMS and Microsystems
1.1 MEMS and Microsystem
1.2 Typical MEMS and Microsystems Products
1.3 Evolution of Microfabrication
1.4 Microsystems and Microelectronics
1.5 The Multidisciplinary Nature of Microsystems Design and
Manufacture
1.6 Microsystems and Miniaturization
1.7 Application of Microsystems in Automotive Industry
1.8 Application of Microsystems in Other Industries
1.9 Markets for Microsystems
Problems
Chapter 2: Working Principles of Microsystems
2.1 Introduction
2.2 Microsensors
2.3 Microactuation
2.4 MEMS with Microactuators
2.5 Microaccelerometers
2.6 Microfluidics
Problems
Chapter 3: Engineering Science for Microsystems Design and
Fabrication
3.1 Introduction
3.2 Atomic Structure of Matters
3.3 Ions and Ionization
3.4 Molecular Theory of Matter and Inter-molecular Forces
3.5 Doping of Semiconductors
3.6 The Diffusion Process
3.7 Plasma Physics
3.8 Electrochemistry
Problems
Chapter 4: Engineering Mechanics for Microsystems
Design
4.1 Introduction
4.2 Static Bending of Thin Plates
4.3 Mechanical Vibration
4.4 Thermomechanics
4.5 Fracture Mechanics
4.6 Thin Film Mechanics
4.7 Overview on Finite Element Stress Analysis
Problems
Chapter 5: Thermofluid Engineering and Microsystems
Design
5.1 Introduction
5.2 Overview on the Basics of Fluid Mechanics in Macro and
Mesoscales
5.3 Basic Equations in Continuum Fluid Dynamics
5.4 Laminar Fluid Flow in Circular Conduits
5.5 Computational Fluid Dynamics
5.6 Incompressible Fluid Flow in Microconduits
5.7 Overview on Heat Conduction in Solids
5.8 Heat Conduction in Multi-layered Thin Films
5.9 Heat Conduction in Solids in Submicrometer Scale
Problems
Chapter 6: Scaling Laws in Miniaturization
6.1 Introduction to Scaling
6.2 Scaling in Geometry
6.3 Scaling in Rigid-Body Dynamics
6.4 Scaling in Electrostatic Forces
6.5 Scaling of Electromagnetic Forces
6.6 Scaling in Electricity
6.7 Scaling in Fluid Mechanics
6.8 Scaling in Heat Transfer
Problems
Chapter 7: Materials for MEMS and Microsystems
7.1 Introduction
7.2 Substrates and Wafers
7.3 Active Substrate Materials
7.4 Silicon as a Substrate Material
7.5 Silicon Compounds
7.6 Silicon Piezoresistors
7.7 Gallium Arsenide
7.8 Quartz
7.9 Piezoelectric Crystals
7.10 Polymers
7.11 Packaging Materials
Problems
Chapter 8: Microsystems Fabrication Processes
8.1 Introduction
8.2 Photolithography
8.3 Ion Implantation
8.4 Diffusion
8.5 Oxidation
8.6 Chemical Vapor Deposition
8.7 Physical Vapor Deposition - Sputtering
8.8 Deposition by Epitaxy
8.9 Etching
8.10 Summary of Microfabrication
Problems
Chapter 9: Overview of Micromanufacturing
9.1 Introduction
9.2 Bulk Micromanufacturing
9.3 Surface Micromachining
9.4 The LIGA Process
9.5 Summary on Micromanufacturing
Problems
Chapter 10: Microsystem Design
10.1 Introduction
10.2 Design Considerations
10.3 Process Design
10.4 Mechanical Design
10.5 Mechanical Design Using Finite Element Method
10.6 Design of Silicon Die of a Micropressure Sensor
10.7 Design of Microfluidics Network Systems
10.8 Computer-Aided Design
Problems
Chapter 11: Assembly, Packaging and Testing of
Microsystems
11.1 Introduction
11.2 Overview of Microassembly
11.3 The High Costs of Microassembly
11.4 Microassembly Processes
11.5 Major Technical Problems in Microassembly
11.6 Microassembly Work Cells
11.7 Challenging Issues in Microassembly
11.8 Overview of Microsystems Packaging
11.9 General Considerations in Packaging Design
11.10 The Three Levels of Microsystems Packaging
11.11 Interfaces in Microsystems Packaging
11.12 Essential Packaging Technologies
11.13 Die preparation
11.14 Surface Bonding
11.15 Wire bonding:
11.16 Sealing and Encapsulation
11.17 Three-dimensional Packaging
11.18 Selection of Packaging Materials
11.19 Signal Mapping and Transduction
11.20 Design Case on Pressure Sensor Packaging
11.21 Reliability in MEMS Packaging
11.22 Testing for Reliability
Problems
Chapter 12: Introduction to Nanoscale Engineering
12.1 Introduction
12.2 Micro and Nanoscale Technologies
12.3 General Principle in Nanofabrication
12.4 Nanoproducts
12.5 Applications of Nanoproducts
12.6 Quantum Physics
12.7 Molecular Dynamics
12.8 Fluid Flow in Submicrometer and Nano Scales
12.9 Heat Conduction in Nanoscale
12.10 Measurement of Thermal Conductivity
12.11 Challenges in Nanoscale Engineering
12.12 Social Impacts of Nanoscale Engineering
Problems
Bibliography
Index.
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